Package making – Methods – Filling preformed receptacle and closing
Patent
1996-03-15
1997-11-04
Coan, James F.
Package making
Methods
Filling preformed receptacle and closing
53485, 53492, 53553, 206713, B65B 902, B65B 3300, B65D 7302
Patent
active
056827318
ABSTRACT:
A carrier tape for electronic or electrical devices which contains a pocketless support film, a fastening layer on the support film, and a deformable cover film separably attached to the fastening layer. The devices are sandwiched between the fastening layer and the cover film, which deforms to provide an enclosure for the devices.
REFERENCES:
patent: 3655496 (1972-04-01), Ettre et al.
patent: 4575995 (1986-03-01), Tabuchi et al.
patent: 4753061 (1988-06-01), Braden et al.
patent: 5325654 (1994-07-01), Juntunen et al.
patent: 5390472 (1995-02-01), Weiler et al.
patent: 5448874 (1995-09-01), Lemonnier
patent: 5524765 (1996-06-01), Gutentag
Trade Brochure entitled "Shin-Etsu Electro-Pack Carrier Tape" published by Shin-Etsu Polymer Co. Ltd. (Date Unknown).
Coan James F.
Vichem Corporation
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