Tape bonding apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

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Details

156495, 156522, 156552, 226 33, 226 45, B32B 3104

Patent

active

054436796

ABSTRACT:
A tab tape bonder including a bonding device which bonds semiconductor chips, etc. to a tab tape, a first roller driver which feeds the tab tape into the bonding device, a detector which detects holes or perforations formed in the tab tape fed by the first roller driver, and a controller which controls the feeding pitch of the tab tape by the first roller driver in accordance with the detection results obtained by the detector.

REFERENCES:
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patent: 4505772 (1985-03-01), Renz
patent: 4571354 (1986-02-01), Maxwell
patent: 4582421 (1986-04-01), Hamlin et al.
patent: 4617080 (1986-10-01), Kobayashi et al.
patent: 4661192 (1987-04-01), McShane
patent: 4804432 (1989-02-01), Jurrius et al.
patent: 4807790 (1989-02-01), Ushioda et al.
patent: 5052606 (1991-10-01), Cipolla et al.
patent: 5223063 (1993-06-01), Yamazaki et al.

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