1989-01-30
1990-03-27
James, Andrew J.
357 70, 357 71, H01L 2312, H01L 2348, H01L 2302
Patent
active
049125478
ABSTRACT:
Multiple, single conductor, tape automated bonding (TAB) tapes are sequentially applied to a semiconductor device by the bonding of a first, etched, single layer TAB tape to an outer row of bonding pads on a semiconductor chip and to selected contacts on a lead frame followed by the laying down of at least one additional etched, single layer TAB tape which is then bonded to an inner row of bonding pads on the semiconductor chip and to different selected lead frame contacts. If desired the subsequent TAB tape may be adhered to the preceding TAB tape to increase the mechanical strength of all the tapes and improve the electrical characteristics of the tapes. The application of one or more ground planes to the assembly is also shown.
REFERENCES:
patent: 3628105 (1971-12-01), Sukai et al.
patent: 4538210 (1985-08-01), Schaller
patent: 4638348 (1987-01-01), Brown et al.
patent: 4801765 (1989-01-01), Moyer et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4827377 (1989-03-01), Butt
Bilowith James A.
Dombroski Edward J.
Guthrie William H.
Noth Richard W.
International Business Machines - Corporation
James Andrew J.
Nguyen Viet Q.
Thornton Francis J.
LandOfFree
Tape bonded semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape bonded semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape bonded semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1654974