Tape BGA package die-up/die down

Details Tape BGA package die-up/die down Tape BGA package die-up/die down

1995-02-17

1996-04-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257693, 257778, 257786, H01R 2368

Patent

active

055067565

ABSTRACT:
A ball grid array (BGA) package which contains an integrated circuit die that is directly mounted to either a heat sink or a printed circuit board. In one embodiment, the package has an integrated circuit with surface pads that are coupled to a flexible circuit board. Solder balls are attached to the flexible circuit board and solder the BGA package to a printed circuit board. The flexible circuit has an opening that exposes the integrated circuit and allows the IC to be soldered to the printed circuit board by solder balls attached directly to the surface pads of the IC die. The direct attachment between the die and printed circuit board increases the number of IC output pins. The flexible circuit board and die are covered by a protective injection molded plastic housing. In a second embodiment, the integrated circuit die is flipped upside down and a surface of the die is exposed through the plastic housing. A heat sink can be attached to the exposed die surface to improve the thermal performance of the package.

REFERENCES:
patent: 5065921 (1991-09-01), Lin et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5311402 (1994-05-01), Kobayashi et al.

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