Tape-ball grid array type semiconductor device having reinforcem

Details Tape-ball grid array type semiconductor device having reinforcem Tape-ball grid array type semiconductor device having reinforcem

1998-02-12

2000-06-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, 361774, 257704, 257738, 257778, 438121, H05K 702

Patent

active

060785063

ABSTRACT:
An Tape-BGA type semiconductor device can absorb and/or distribute stress created due to difference of thermal expansion between a reinforcement plate of a TAB tape and a mounting substrate to stabilize mounting on a substrate. The Tape-BGA type semiconductor device includes leads formed on an insulative resin film, and electrically connected to electrodes of a semiconductor chip at tip ends thereof, a reinforcement plate formed with an opening portion receiving the semiconductor chip and fixed on the surface of the insulative resin film, a plurality of ball-shaped bumps are arranged on externally connecting portions of the leads in a grid-array fashion, and the reinforcement plate being provided with slits along the opening portion for distributing stress.

REFERENCES:
patent: 5586010 (1996-12-01), Murtuza et al.
patent: 5652184 (1997-07-01), Goto et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5914531 (1999-06-01), Tsunoda et al.

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