Tape ball grid array package with perforated metal stiffener

Details Tape ball grid array package with perforated metal stiffener Tape ball grid array package with perforated metal stiffener

1997-09-22

1998-11-10

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174252, 257707, 257738, 361688, 361690, 361692, 361807, 361809, H05K 704, H05K 708, H05K 720

Patent

active

058353550

ABSTRACT:
A tape ball grid array (TBGA) package, and a method of making a TBGA package, includes the use of a metal or other stiffener affixed to a flexible tape on which conductive traces connect contact points on an integrated circuit (IC) chip with an array of solder balls. The stiffener is perforated with a pattern of small vent holes. The TBGA package materials are hygroscopic. When the TBGA package is heated during 2nd level packaging, e.g., during solder reflow, moisture absorbed within the hygroscopic materials evaporates and the resulting water vapor is able to escape through the vent holes, rather than becoming trapped within the IC package and introducing various 2nd level packing failure modes.

REFERENCES:
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285350 (1994-02-01), Villaume
patent: 5369550 (1994-11-01), Kwon
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5485037 (1996-01-01), Marrs
patent: 5490324 (1996-02-01), Newman
patent: 5506756 (1996-04-01), Haley
patent: 5511306 (1996-04-01), Denton et al.
patent: 5550406 (1996-08-01), McCormick
patent: 5598321 (1997-01-01), Mostafazadeh et al.
patent: 5602422 (1997-02-01), Schueller et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5640048 (1997-06-01), Selna
patent: 5652185 (1997-07-01), Lee
patent: 5673479 (1997-10-01), Hawthorne
Huang, et al., "Area Tape Automated Bonding Ball Grid Aray Technology", McGraw-Hill. Inc., pp. 433-464 (1995).

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