Tape automated wire bonded integrated circuit chip assembly

Details Tape automated wire bonded integrated circuit chip assembly Tape automated wire bonded integrated circuit chip assembly

1981-06-18

1984-07-10

James, Andrew J.

357 70, 357 80, 357 81, H01L 2348, H01L 3902, H01L 2302

Patent

active

044596073

ABSTRACT:
The present disclosure describes the fabrication of subminiature electronic devices incorporating conventional integrated circuit (IC) chips or dies. The IC assembly which may be advantageously realized by tape automated bonding processes utilizes an etched double metal clad plastic carrier which allows the chip to be mounted directly to a metallic base formed on one surface of the carrier and to have its signal pads wire bonded to a metallic lead frame disposed on the opposite surface thereof.

REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3665256 (1972-05-01), Goun et al.
patent: 4027326 (1977-05-01), Kummer et al.
patent: 4259436 (1981-03-01), Tabuchi et al.

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