Tape automated bonding semiconductor package

Details Tape automated bonding semiconductor package Tape automated bonding semiconductor package

1987-06-08

1990-04-03

Hille, Rolf

357 68, H01L 2354, H01L 2348

Patent

active

049147412

ABSTRACT:
A semiconductor package for protecting a semiconductor chip such as a Very Large Scale Integration chip and connecting it to an electrical circuit is disclosed. The chip is bonded to a section of Tape Automated Bonding, (TAB), tape which contains a number of leads thereover, each lead has an inner lead section bonded to the chip and an outer lead section that extends beyond the outer perimeter of the tape, for connecting to the circuit. The chip is enclosed in a housing which subtends an area slightly larger than the chip itself. The inner lead sections project from the TAB tape into the housing and are bonded to the chip. A metal layer under the TAB tape is connected to a number of the leads. After the semiconductor package of this invention is assembled, the outer leads are attached to the associated circuit so as to connect the chip to the circuit. The metal layer serves as a reference plane so the leads connected thereto supply a voltage that does not very to sub-circuits on the chip.

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