Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-11-25
1994-10-18
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174254, 174259, 2281801, 257668, 257700, 257707, 257712, 361749, H05H 720
Patent
active
053574001
ABSTRACT:
A TAB(tape automated bonding) device is provided with a multi-metal-layer film tape for each semiconductor chip. Two parallel grounding conductor layers and a power supply conductor layer sandwiched between the two grounding conductor layers are formed in the multi-metal-layer film tape, and grounding leads which are connected to grounding terminals of the semiconductor chip are connected to the grounding conductor layer, and power supply leads which are connected to power supply terminals of the chip are connected to the power supply conductor layer.
REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 5036380 (1991-07-01), Chase
IBM Tech. Dis. Bulletin "Plane Electrical Enhancement", vol. 32, No. 10, Mar. 1990, pp. 85-86.
"TAB Tames High-Density Chip I/Os" by Howard W. Markstein, E P and P, Dec. 1988.
NEC Corporation
Thompson Gregory D.
LandOfFree
Tape automated bonding semiconductor device and production proce does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape automated bonding semiconductor device and production proce, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape automated bonding semiconductor device and production proce will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2376780