Patent
1991-12-18
1992-10-20
James, Andrew J.
357 73, 357 81, 357 80, H01L 2328, H01L 2325
Patent
active
051574780
ABSTRACT:
A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.
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`AIN Heat Sink Banding to the Chip`, IBM Tech. Discl. Bul., Jan. 90.
Seki Hiroshi
Shimamoto Haruo
Teraoka Yasuhiro
Ueda Tetsuya
Yagoura Hideya
James Andrew J.
Meier Stephen D.
Mitsubishi Denki & Kabushiki Kaisha
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