Tape automated bonding of integrated circuits

Details Tape automated bonding of integrated circuits Tape automated bonding of integrated circuits

1983-12-27

1986-02-18

Woo, Jay H.

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156253, 357 80, 428209, B32B 310

Patent

active

045713545

ABSTRACT:
A method and apparatus are presented for tape automated bonding of integrated circuits wherein a support ring is formed in the feature window to provide reinforcement for unsupported interconnection leads between the inner and outer lead bond sites.

REFERENCES:
patent: 4007479 (1977-02-01), Kowalski
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4390598 (1983-06-01), Phy
patent: 4407872 (1983-10-01), Horii
patent: 4459607 (1984-07-01), Reid
patent: 4472762 (1984-09-01), Spinelli et al.

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