Tape automated bonding leads having a stiffener and a method of

Details Tape automated bonding leads having a stiffener and a method of Tape automated bonding leads having a stiffener and a method of

1989-12-21

1991-07-23

Laroche, Eugene R.

Electric heating

Metal heating

By arc

21912167, 29827, 437220, 357 70, 174 524, B23K 2614, H01R 2700, H01L 2348, H01L 2302

Patent

active

050345915

ABSTRACT:
An improved lead structure for tape automated bonding includes a stiffener which is an integral part of the leads. The stiffener maintains the alignment and spacing of the leads during fabrication and subsequent processing, e.g., bonding to a semiconductor chip. A laser is used to remove (or excise) the stiffener from the leads by cutting the leads individually or in groups. Several methods may be used to protect the semiconductor chip during excising, including focussing the beam so that the spot diameter at the focal point of the beam is less than one third of the distance between the focal point and the semiconductor device, providing a protective (e.g., reflective) coating on the semiconductor chip, or providing the laser beam with a shallow depth of field so that the beam is diverged at the surface of the semiconductor chip.

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