Electricity: electrical systems and devices – Miscellaneous
Patent
1990-04-02
1992-03-24
Picard, Leo P.
Electricity: electrical systems and devices
Miscellaneous
361399, 357 75, 439 68, 439 74, H05K 702
Patent
active
050993925
ABSTRACT:
A Tape-Automated Bonding (TAB) Frame Adapter System for providing an interface to a device having a plurality of closely spaced leads is disclosed. The preferred embodiment of the invention comprises a dielectric rectilinear adapter ring or platform that includes upper and lower surfaces. Four sidebars enclose a central aperture. Each pair of sidebars terminates in a corner junction which protrudes away from the central aperture. The sidebars bear rows of conductors which register with high density leads on the periphery of a TAB frame and a printed circuit board. Each corner junction is designed to include a through-hole, which is surrounded by a metal insert, and an alignment pin. The adapter ring is a critical element of a novel TAB assembly comprising a TAB frame bearing a chip, an elastomer, a lid, and a PC board. A set of screws fit in a set of holes in a lid and in a PC board to hold the entire assembly in compression. The conductors which form the interface are either metal strips that are draped over the adapter ring or protruding members which are embedded in slots formed in the adapter ring. The conductors are deployed in two interleaved rows, one along the edge closest to the central aperture, and another on the opposite edge. Any adjacent pair of draped conductors is affixed to the top surface of the adapter ring so that the lower portions of the pair are pointed in opposite parallel directions.
REFERENCES:
patent: 4593961 (1986-06-01), Cosmo
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patent: 4744009 (1988-05-01), Grabbe et al.
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Product Brochure from AMP, Inc. dated Sep. 1, 1989: "Micro Interposer Socket".
"TAB Update" excerpt from SMT Trends, pp. 8-9.
"High Density Packaging Technology Ultra Tin Package And New Tab Package" by O. Nakagawa et al., published in Journal of Electronic Materials, vol. 18, No. 5, pp. 633-643, 1989.
"Getting Started in TAB", by S. Banks, published in Surface Mount Technology, Aug. 1989, pp. 42-45.
"COB and TAB: Evaluating The New Assembly Technologies" by D. Feindel, published in Surface Mount Technology, Aug. 1989, pp. 47-50.
Product Brochure from Motorola, Inc.: "MCA10000ECL Macrocell Array".
"Multi-Chip Packaging From Digital".
"Interconnecting Multichip ICs in a Plastic Package" by Larry Hobson, published in Electronic Packaging & Production, Oct. 1989, p. 58 et seq.
Miller Michael C.
Plas Hugh V.
Hewlett--Packard Company
Picard Leo P.
Sparks Donald A.
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