Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-03-28
1995-03-21
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361748, 361749, 361772, 361776, 361810, 361813, 257666, 174 521, 174259, 174261, 22818021, H05K 702
Patent
active
054002192
ABSTRACT:
An article of manufacture which has a substrate including electrical leads and bond pads electrically connected to the leads. Two or more integrated circuit semiconductor chips are supported on the substrate. Each of the chips includes a plurality of edges and a plurality of input/output (I/O) bond pads. A portion of the bond pads on each chip are located adjacent at least one edge of the respective chip. At least two separate sections of Tape Automated Bonding (TAB) tape electrically connect the I/O bond pads on each chip to the bond pads on the substrate. In a refinement of the invention, the sections of TAB tape each include a plurality of inner lead bond leads extending from a longitudinal (along the tape length) edge of the tape. Each inner lead bond is connectable to one of the I/O bond pads on the chips. The inner lead bond leads are located a uniform distance apart from each other, this distance equalling the smallest distance apart between adjacent bond pads on any chip which the TAB tape is compatible with.
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Pian Thomas R.
Reele Samuel
Eastman Kodak Company
Picard Leo P.
Rushefsky Norman
Whang Young
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