Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-08-08
1998-06-16
Graybill, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438111, 438113, H01L 2158, H01L 2160, H01L 2170
Patent
active
057669830
ABSTRACT:
A process for manufacturing a tape automated bonding circuit with interior sprocket holes including: a substrate; at least one conductor deposited on the substrate; a functional area on the substrate defined by a polygon surrounding the conductor with all sides of the polygon adjacent to a segment of the conductor and with interior angles of the polygon between the sides of the polygon greater or equal to ninety degrees and having at least one sprocket hole within the functional area on the substrate. The sprocket hole is used to engage and drive the tape automated bonding circuit through processing steps. In a specific embodiment the functional area on the substrate has a first set of two sprocket holes within the functional area, which are used to engage and drive the tape automated bonding circuit through processing steps. In an alternate specific embodiment the substrate has a second set of two sprocket holes in the substrate, which are used to engage and drive the tape automated bonding circuit through processing steps. In another specific embodiment, the length between the first set of sprocket holes and the second set of sprocket holes divided into the length of the substrate is an integer.
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Graybill David
Hewlett--Packard Company
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