Chemistry: electrical and wave energy – Processes and products
Patent
1989-12-18
1990-07-31
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
29827, C25D 502
Patent
active
049448501
ABSTRACT:
Improved TAB circuit and method for producing the same. Specifically, new methods and materials are used to electro-plate and test TAB circuits. A typical TAB circuit includes a substrate having a plurality of conductive traces thereon, each trace terminating in a lead. All of the leads extend inwardly into a window through the substrate. To short the leads for electro-plating, a metal conductive portion is provided within the window which is attached to the leads. The conductive portion may consist of a separate unit secured to the leads, or may be integrally formed with the leads as a single unit. Testing of the traces for opens is accomplished by running a current from the conductive portion to the opposite end of each trace. For short testing, the conductive portion is easily severed from all of the leads using a punch assembly or the like.
REFERENCES:
patent: 4380042 (1983-04-01), Angelucci, Sr. et al.
patent: 4806409 (1989-02-01), Walter
Dixon, T., "TAB Technology Tackles High-Density Interconnections", Electronic Packaging and Production, pp. 35-39 (Dec. 1984).
Cain, R., "Beam Tape Carriers--A Design Guide", Solid State Technology, (Mar. 1978).
Rima, P., "The Basics of Tape Automated Bonding", Hybrid Circuit Technology, pp. 15-21 (Nov. 1984).
Hoffman, P., "Tab Implementation and Trends", Solid State Technology, pp. 85-88 (Jun. 1988).
Holzinger, S., Report delivered at EXPO SMT 1986 (Rogers Corporation) entitled "Tab Types and Materials".
Metal Finishing, Michael Murphy, editor, Metals and Plastic Publications, Hackensack, N.J., vol. 83, No. 1A (Jan. 1985).
Lowenheim, F. A., Electroplating: Fundamentals of Surface Finishing, McGraw-Hill, Inc., 1978.
Hewlett--Packard Company
Tufariello T. M.
LandOfFree
Tape automated bonded (tab) circuit and method for making the sa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape automated bonded (tab) circuit and method for making the sa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape automated bonded (tab) circuit and method for making the sa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1397331