Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1986-03-06
1987-07-28
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
158521, 158530, 158567, 156521, 156530, 156567, B32B 3104
Patent
active
046830235
ABSTRACT:
A machine for applying an adhesive pad to the ends of semiconductor device packages includes a punch assembly, a tape feed assembly, and a package feed assembly. The tape is incrementally fed to the punch assembly where semiconductor packages are individually brought into alignment. The punch assembly first shears an adhesive pad from the tape and thereafter applies the pad to the package. The punch member of the punch assembly includes a resilient tip which assures that the tape is securely attached to the package and helps prevent damage to the package. Semiconductor device packages having such taped ends are less likely to be damaged in subsequent processing and handling.
REFERENCES:
patent: 1809341 (1931-06-01), Jensen
patent: 2627212 (1953-02-01), Connor et al.
patent: 4181554 (1980-01-01), Rich
patent: 4214944 (1980-07-01), Lemke
patent: 4279682 (1981-07-01), Hamagami et al.
patent: 4355719 (1982-10-01), Hinds et al.
patent: 4518096 (1986-04-01), Sato
Advanced Micro Devices , Inc.
Heslin James M.
King Patrick T.
Weston Caleb
LandOfFree
Tape attach machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape attach machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape attach machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2033656