Tape application method and tape application device

Details Tape application method and tape application device Tape application method and tape application device

2008-03-06

2011-11-15

Gray, Linda L (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S152000, C156S249000, C156S256000, C156S264000, C156S265000, C156S523000, C156S577000, C156S715000, C156S759000, C156S919000, C156S931000, C156S935000

Reexamination Certificate

active

08057627

ABSTRACT:
A method and device (1) are provided for applying laminated tapes (2, 3) with an adhesive tape (2) and a cover tape (3) on a surface (4). The tape application device (1) includes a frame (5), a tape winder (8) for the laminated tape (2, 3), a tape winder (9) for the pulled-off cover tape (3), a tape guide (14) and a pressure-exerting device (18) for pressing the adhesive tape (2) onto a surface (4). During application, the cover tape (3) is at some parts detached and guided away from the adhesive tape (2), wherein the adhesive tape (2) can be severed at the detachment point and can be pressed onto the surface (4) with two closely adjacent pressing elements (19, 20).

REFERENCES:
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patent: 6187128 (2001-02-01), Oosterlinck
patent: 2002/0189746 (2002-12-01), Kuta et al.
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patent: 0 640 545 (1995-03-01), None

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