Tape application jig for pressure sensitive adhesive tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Work-secured and/or work-guided

Reexamination Certificate

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Details

C156S538000, C156S556000, C156S574000, C156S071000, C156S166000, C156S247000

Reexamination Certificate

active

10530468

ABSTRACT:
A tape application jig (10) comprising a tape application head (2), a jig guide (3) and a tape holding member consisting of a pair of members (6, 16) combined so as to face each other in vertical direction. The jig guide (3) comprises a guide pin (13) capable of abutting during the movement of the jig guide against the surface of the adherent opposite to the tape applying surface portion.

REFERENCES:
patent: 6585023 (2003-07-01), Azuhata
patent: 6698489 (2004-03-01), Shinozaki et al.
patent: 6748993 (2004-06-01), Shinozaki et al.
patent: 2000159426 (2000-06-01), None
patent: 2001-97636 (2001-04-01), None
patent: 2001171570 (2001-06-01), None
patent: 2001-328573 (2001-11-01), None
patent: 2002-167110 (2002-06-01), None
patent: WO 01/10703 (2001-02-01), None
English Machine Translation of JP 2001-97636.
English Machine Translation of JP 2000-159426.
English Abstract of JP 2000-159426.

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