Tape adhering method and tape adhering apparatus

Details Tape adhering method and tape adhering apparatus Tape adhering method and tape adhering apparatus

2005-03-24

2008-10-21

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S353000, C156S360000, C156S361000

Reexamination Certificate

active

07438776

ABSTRACT:
A method and an apparatus for adhering a tape (3) on a wafer (20) are disclosed. The wafer is supported on a table (31), and the tape is supplied, between a tape adhering surface (20′) and a tape adhering unit (46), from a tape supply unit (42). The table is moved toward the tape adhering unit, whereby the tape adhering surface of the wafer on the table is pressed against the tape adhering unit through the tape with a force (F). Further, the tape adhering unit is moved from one end (28) to the other end (29) of the wafer in parallel to the tape adhering surface. The pressure (P) under which the tape adhering surface is in contact with the tape adhering unit through the tape is kept substantially uniform while the tape adhering unit moves from one end to the other end of the wafer. As a result, the pressure on the wafer is accurately equalized in spite of the movement of the tape adhering unit.

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Translation of JP 2002-134438 (document filed and listed on Mar. 24, 2005 IDS).
Patent Abstract of Japan, Publication No. 2002134438 A, Published on May 10, 2002, in the name of Tanigawa.
European Search Report for application No. 05251381.9, dated Jun. 14, 2006, in the name of Tokyo Seimitsu Co., Ltd.
Derwent Abstract corresponding to Publication No. JP2002-222779-A, dated Aug. 9, 2002, in the name of Moriya Kazuhiro.
Australian Examination/Search Report dated Jun. 16, 2006 for corresponding SG 200501479-0, in the name of Tokyo Seimitsu Co., Ltd.

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