Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Reexamination Certificate
2005-04-12
2009-11-24
Aftergut, Jeff (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Chamber enclosing work during bonding and/or assembly
C156S154000, C156S248000, C156S286000, C156S312000
Reexamination Certificate
active
07621307
ABSTRACT:
A device and a method for bonding a tape, by which a tape member may be preferably bonded to a work piece, and simplified processing, reduced cost, and improved bonding strength may be realized. A tape bonding device which bonds a tape member to a work piece includes an elastic sheet member on the upper surface of which the work piece is mounted, a vacuum chamber which is located on the side of the upper surface of the elastic sheet member, an air introducing section which is located on the side of the lower surface of the elastic sheet member, a mounting section on which the elastic sheet member is mounted, a holding member which holds the elastic sheet member in a state in which the air is prevented from being carried into the vacuum chamber, a tape holding unit which holds the tape member in the upper portion of the work piece, a first sucking unit for vacuum suction of the inside of the vacuum chamber, a second sucking unit for vacuum suction of the air introducing section, an air introducing unit which introduces the air into the air introducing section, and a pressurizing unit which introduces the air into the inside of the vacuum chamber in a pressurized state.
REFERENCES:
patent: 6113724 (2000-09-01), Ogawa
patent: 2003/0173017 (2003-09-01), Hecht et al.
patent: 02054564 (1990-02-01), None
patent: 10-233430 (1998-09-01), None
patent: 2003007808 (2003-01-01), None
patent: 2005/026377 (2005-01-01), None
patent: 2005026377 (2005-01-01), None
patent: 2005-129678 (2005-05-01), None
Saito Kimikazu
Suzuki Tetsushi
Aftergut Jeff
Cowan Liebowitz & Latman P.C.
Montague Mark
Slawski Brian R
Tsubaki Seiko Inc.
LandOfFree
Tape adhering apparatus and tape adhering method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape adhering apparatus and tape adhering method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape adhering apparatus and tape adhering method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4093724