Tantalum sputtering target and method for preparation thereof

Details Tantalum sputtering target and method for preparation thereof Tantalum sputtering target and method for preparation thereof

2006-09-19

2010-06-22

Kastler, Scott (Department: 1793)

Metal treatment

Stock

Vanadium, niobum, or tantalum base

C148S668000, C204S298120, C204S298130

Reexamination Certificate

active

07740717

ABSTRACT:
Provided is a tantalum sputtering target having a crystal structure in which the (222) orientation is preferential from a position 10% of the target thickness toward the center face of the target, and a manufacturing method of a tantalum sputtering target, including the steps of forging and recrystallization annealing, and thereafter rolling, a tantalum ingot or billet having been subject to melting and casting, and forming a crystal structure in which the (222) orientation is preferential from a position of 10% of the target thickness toward the center face of the target. As a result, evenness (uniformity) of the film is enhanced, and quality of the sputter deposition is improved.

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