Organic compounds -- part of the class 532-570 series – Organic compounds – Heavy metal containing
Patent
1998-01-23
2000-01-18
Nazario-Gonzalez, Porfirio
Organic compounds -- part of the class 532-570 series
Organic compounds
Heavy metal containing
556 28, 556 42, 556 43, 4272481, C07F 900, C07F 728, C07F 1900
Patent
active
060159170
ABSTRACT:
Tantalum and titanium source reagents are described, including tantalum amide and tantalum silicon nitride precursors for the deposition of tantalum nitride material on a substrate by processes such as chemical vapor deposition, assisted chemical vapor deposition, ion implantation, molecular beam epitaxy and rapid thermal processing. The precursors may be employed to form diffusion barrier layers on microlectronic device structures enabling the use of copper metallization and ferroelectric thin films in device construction.
REFERENCES:
patent: 2839421 (1958-06-01), Albisetti
patent: 3076834 (1963-02-01), Norton
patent: 3288829 (1966-11-01), Wilkinson
patent: 3437516 (1969-04-01), Tamborski
patent: 3988332 (1976-10-01), Schrock
patent: 4147556 (1979-04-01), Donley
patent: 4281037 (1981-07-01), Choung
patent: 4401474 (1983-08-01), Donley
patent: 4510222 (1985-04-01), Okunaka et al.
patent: 4529427 (1985-07-01), French
patent: 4726938 (1988-02-01), Rollat et al.
patent: 4898842 (1990-02-01), David
patent: 4908065 (1990-03-01), Tanitsu et al.
patent: 5034372 (1991-07-01), Matsuno et al.
patent: 5110622 (1992-05-01), Hasegawa et al.
patent: 5120703 (1992-06-01), Snyder et al.
patent: 5165960 (1992-11-01), Platts
patent: 5204314 (1993-04-01), Kirlin et al.
patent: 5225561 (1993-07-01), Kirlin et al.
patent: 5280012 (1994-01-01), Kirlin et al.
patent: 5376409 (1994-12-01), Kaloyeros et al.
patent: 5412129 (1995-05-01), DiCarolis
patent: 5679815 (1997-10-01), Kirlin et al.
patent: 5711816 (1998-01-01), Kirlin et al.
Yu. E. Ovchinnikov, et al. "The Crystal Structures of the Titanium-Containing Organosilicon Compounds (SiMe.sub.3).sub.3 and (SiMe.sub.3).sub.3 GeTi(Nme.sub.2).sub.3 " Metalloorg. Khim, (Organometallic Chem. In USSR), 1992, vol. 5, p. 564.
Yu, E. Ovchinnikov Yu. T. Struchkov M. V. Ustinov, M.G. Voronkov, Crystal and Molecular Structure of Organosilicon Derivatives of Titanium (IV) (Me.sub.3 Si).sub.3 SiTi(Net.sub.2).sub.3 and CiTi[N(SiMe.sub.3).sub.2 9.sub.3 Izu. Akad. Nauk SSSR, Ser. Khim., 1993, p. 1473.
M.T. Bohr, "Scaling of High performance Interconnects", Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, MRS Publisher, 1997, p. 3.
M.B. Small, D. Pearson, "On-Chip Wiring for VLSI Status and Directions", IBM J. Res. Dev., 1990, vol. 34, pp. 858-867.
S. P. Maruka, R. J. Gutman, A. Kaloyeros and W. A. Lanford, "Advanced Multilayer Metallization Schemes with Copper as Interconnection Metal", Thin Solid Films, 1994, vol. 236, pp. 257-266.
K. Holloway, et al., "Tantalum as a Diffusion Barrier Between Copper and Silicon: Failure Mechanism and Effect of Nitrogen Additions," J. Appl. Phys., 1992 vol. 71, pp. 5433-5444.
J.O. Olowolafe, C.J. Mogab, R.B. Gregory and M. Kottke,"Interdiffusions in Cu/Reactive-Ion-Sputtered TiN, Cu/Chemical-Vapor-Deposited TiN, Cu/TaN and TaN/Cu/TaN Thin-Film Structures: Low Temperature Diffusion Analyses", J. Appl. Phys., 1992, vol. 72, pp. 4099-4103.
E. Kolawa, "Tantalum-Based Diffusion Barriers in Si/Cu VLSI Metallizations", J. Appl. Phys., 1991, vol. 70, pp. 1369-1373.
S.-Q. Wang, et al., "Step Coverage Comparison of Ti/TiN Deposited by Collimated and Uncollimated Physical Vapor Deposition Techniques", J. Vac. Sci. Technol. B, 1996, vol. 14(3), pp. 1846-1852.
J.C. Fuggle et al, "Reactions of Niobium and Tantalum Pentafluorides with Trimethylsilyldiethylamine and with Trimethlysilyl Chloride", 1972, pp. 1766-1767.
K. Hieber, "Structural and Electrical Properties of Ta and Ta Nitrides Deposited by Chemical Vapour Deposition", Thin Solid Films, 1974, vol. 24, pp. 157-164.
R. Fix, R.G. Gordon, D.M. Hoffman, "Chemical Vapor Deposition of Vanadium, Niobium, and Tantalum Nitride Thin Films", Chem. Mater., 1993, vol. 5, pp. 614-619.
D.N. Williams et al, "Half-sandwich Imido Complexes of Niobium and Tantalum", J. Chem. Soc Dalton Trans., 1992, pp. 739-751.
J. Li, T. E. Seidel, J. W. Mayer, "Copper-Based Metallization in ULSI Structures", MRS Bulletin, 1994, vol. XIX, No. 8, pp. 15-18.
S.M. Rossangel, et al.,"Thin, High Atomicn Weight Refractory Film Deposition for Diffusion Barrier, Adhesion Layer, and Seed Layer Applications" J. Vac. Sci. Technol. B, vol. 14, pp. 1819-1827.
D. Ugolini, S.P. Kowalczyk, F.R. McFeely, "Photoelectron Spectroscopy Studies of Chemical Vapor Deposition of Ta from a TaF.sub.6 Precursor on Si and SiO.sub.2 Substrates" J. Appl. Phys., 1991, vol. 70, p. 3899.
S.J. McLain, et al., "Multiple Metal-Carbon Bonds. The Reaction of Niobium and Tantalum Neopentylidene Complexes with Simple Olefins: A Roule to Metallocyclopentanes", J. Amer. Chem. Soc., 1977, vol. 99, p. 3519.
R. R. Schrock, "Alkylidene Complexes of Niobium and Tantalum", Acc. Chem. Res., 1979, vol. 12, p. 98.
R. R. Schrock, S.M. Rockledge,"Tantalum Complexes Containing Diimido Bridging Dinitrogen Ligands" J. Amer. Chem. Soc., 1980, vol. 102, pp. 7809-7811.
Yuan-Wei Chao et al, "Preparation and Properties of Amido Halide Complexes of Niobium and Tantalum and Reactions with Alkynes", Polyhedron, 1990, vol. 9, No. 22, pp. 2709-2716.
John D. Prostasiewicz, "Synthesis and Structural Characterization of Low Valent Group V Phosphine Complexes", Inorg. Chem., 1992, vol. 31, pp. 4134-4142.
D.C. Bradley et al., "Nuclear Magnetic Resonance Studies on Niobium and Tantalum Penta-alkoxides", J. Chem. Soc. (A), 1968, pp. 219-223.
M.H. Tsai, S.C. Sun, C.P. Lee, H.T. Chiu, C.E. Tsai, S.H. Chuang, S.C. Wu, "Metal-Organic Chemical Vapor Deposition of Tantalum Nitride Barrier Layers for ULSI Applications", Thin Solid Films, 1995, vol. 270, pp. 531-536.
H.T. Chiu, W.P. Chang, "Effect of Hydrogen on Deposition of Tantalum Nitride Thin Films From Ethylimidotantalum Complex", J. Mater. Sci. Lett., 1992, vol. 11, pp. 570-572.
K. Sugiyama, et al., "Low Temperature Deposition of Metal Nitrides by Thermal Decompositon of Organometallic Compounds", J. Electrochem. Soc., 1975, vol. 122, p. 1545.
M.G. Simmonds, W. L. Gladfelter, "Chemical Vapor Deposition of Aluminum", The Chemistry of Metal CVD, T.T. Kodas, M.J. Hampden-Smith, Eds., VCH, New York, 1994.
T.D. Tilley, The Chemistry of Silicon Compounds, S. Patai, Z. Rapporport Eds., Wiley: New York, 1989, vol. 2. p. 1415.
Q. Jiang, P.J. Carroll, D. H. Berry, "Synthesis of Mono- and Bis(silyl) Complexes of Tantalum" Organometallics, 1991, vol. 10, pp. 3648-3655.
"Diffusion Barriers for GaAs and InP Devices", NASA, Tech Briefs, Jun. 1997, p. 42.
"Adherent and Stable Metallization of CVD Diamond", NASA Tech Briefs, Jun. 1997, pp. 63-64.
M.F. Lappert, et al, Metal and Metalloid Amides, John Wiley and Sons, pp. 470-543.
R.P.M. Werner, A.H. Filbey, S.A. Manastyrsky, "Tetracarbonylcyclopentadienyl Compounds of the Group V Transition Metals", Inorg. Chem., 1964, vol. 3, pp. 298-300.
Z. Xue, L. Li, L. K. Hoyt, J.B. Diminnie, J.L. Pollitte, "Early Transition Metal Silyl Complexes Free from Anionic II Ligands. A new Family of Alkyl, Alkylidene, and Alkylidyne Compounds", J. Am. Chem. Soc., 1994, vol. 116, pp. 2169-2170.
W.A. Nugent, R.L. Harlow, "Structure and Reactivity in the Group 5B t-Butylimido Complexes (Me.sub.2 N).sub.3 M=Nbu .sup.t ; X-Ray Crystal and Molecular Structure of N-t-Butylimidotris(dimethylamido)tantalum", J.C.S. Chem. Comm., 1978, pp. 579-580.
A.A. Finn, L. Brandt, H.D. Kaesz, R.F. Hicks, "Chemical Vapor Depositon of Platinum, Palladium and Nickel", The Chemistry of Metal CVD, T.T. Kodas, M.J. Hampden-Smith, Eds., VCH, New York, 1994.
Pradeep P. Phule, "Sol-gel Synthesis of Ferroelectric Lithium Tantalate Ceramics: FTIR Investigation of the Molecular Modification of Tantalum Ethoxide", J. Mater. Res., 1993, vol. 8, No. 2, pp. 334-338.
P.N. Kapoor et al, "Organic Compounds of Niobium and tantalum IV Reactions of Niobium and Tantalum Pentaethoxides with B-Diketones", J. of the Less-Common Metals, 1965, vol. 8., pp. 339-346.
R. L. Deutsher, et al., "Eight Coordinate Tetrakis-Chelate Complexes of Niobium(IV) and Tantalum(V)", Inorganica Chimica Acta, 1970, pp. 645-650.
R.R. Schrock et al, "Multiple Metal Carbon Bonds. "Preparation and Characterization of Formation of the Tantalum and Niobium Neopentylidene Complexes,
Baum Thomas H.
Bhandari Gautam
Advanced Technology & Materials Inc.
Hultquist Steven J.
Nazario-Gonzalez Porfirio
Zitzmann Oliver A.M.
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