Tamperproof arrangement for an integrated circuit device

Details Tamperproof arrangement for an integrated circuit device Tamperproof arrangement for an integrated circuit device

1994-01-10

1995-04-11

Cain, David C.

Cryptography

Electric signal modification

Including particular structure or housing

380 3, 327525, H04L 900

Patent

active

054066301

ABSTRACT:
A tamperproof arrangement for an integrated circuit device. The arrangement includes a package and lid fabricated of heavy metals to prevent X-radiation or infrared detection of circuit operation. Sensors and control circuitry are located on the integrated circuit die itself which detect increased temperature and radiation and clear or zeroize any sensitive information included within the integrated circuit device. Electrode finger grids above and below the integrated circuit die detect physical attempts to penetrate the integrated circuit die. Critical circuit functions are segregated from non-critical functions. Power applied to the integrated circuit device is monitored and separated for critical and non-critical circuit functions.

REFERENCES:
patent: 4691350 (1987-09-01), Kleijne, et al.
patent: 4734883 (1988-03-01), Perkin
patent: 4860351 (1989-08-01), Weingart

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