Tamper-proof electronic coatings

Coating processes – Electrical product produced – Metallic compound coating

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Details

4273763, 427387, 149 15, 149 192, B05D 302, C06B 4510

Patent

active

054589126

ABSTRACT:
Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

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