Tamper indicator for a blister package and method of assembly

Package making – Methods – Forming a cover adjunct or application of a cover adjunct to...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53442, 53449, 53477, B65B 5306, B65B 1152, B65B 902

Patent

active

048768430

ABSTRACT:
A tamper indicator for a blister package having a rupturable lid which is attached to a base formed with recesses that hold articles in the recesses between the lid and the base. The indicator comprises an easily ruptured and tearable film that completely covers the exposed surface of the base and is attached to the lid near the juncture of the lid and the base.

REFERENCES:
patent: 3017729 (1962-01-01), Cheeley
patent: 3050402 (1962-08-01), Dreyfus et al.
patent: 3331495 (1967-07-01), Leckzik et al
patent: 3503493 (1970-03-01), Nagy

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tamper indicator for a blister package and method of assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tamper indicator for a blister package and method of assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tamper indicator for a blister package and method of assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-619519

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.