Tail wire cutting method and bonding apparatus

Details Tail wire cutting method and bonding apparatus Tail wire cutting method and bonding apparatus

2007-04-23

2010-02-09

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S904000

Reexamination Certificate

active

07658314

ABSTRACT:
A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.

REFERENCES:
patent: 4925083 (1990-05-01), Farassat et al.
patent: 5723364 (1998-03-01), Nakamura et al.
patent: 5897049 (1999-04-01), Nakamura et al.
patent: 5981371 (1999-11-01), Yamazaki et al.
patent: 6102275 (2000-08-01), Hill et al.
patent: 6173885 (2001-01-01), Takahashi et al.
patent: 6581283 (2003-06-01), Sugiura et al.
patent: 6595400 (2003-07-01), Terakado et al.
patent: 7262124 (2007-08-01), Fujisawa
patent: 7456091 (2008-11-01), Kuraya et al.
patent: 2001/0022315 (2001-09-01), Tsai et al.
patent: 2003/0162378 (2003-08-01), Mikami
patent: 2006/0175383 (2006-08-01), Mii et al.
patent: 2006/0216863 (2006-09-01), Arakawa
patent: 58169916 (1983-10-01), None
patent: 2723277 (1997-11-01), None
patent: 2969953 (1999-08-01), None

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