Tacky, no-clean thermally dissipated soldering flux

Details Tacky, no-clean thermally dissipated soldering flux Tacky, no-clean thermally dissipated soldering flux

1991-10-22

1992-07-14

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

051299623

ABSTRACT:
A no-clean, thermally dissipated soldering flux is shown which includes hydroabietal alcohol as a flux base, an organic activator and an organic diluent. The hydroabietal alcohol provides a tacky medium which holds a precisely aligned chip in place both during placement and reflow. The nature of the formula renders a reducing atmosphere unnecessary. The composition is thermally dissipated during soldering and leaves no undesirable residue which would require a post-cleaning step.

REFERENCES:
patent: 4168996 (1979-09-01), Zado
patent: 4243440 (1981-06-01), Arbib
patent: 4290824 (1981-09-01), Cole

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