Tacking processes and systems for soldering

Details Tacking processes and systems for soldering Tacking processes and systems for soldering

1996-10-02

1999-11-30

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural diverse bonding

22818022, 228 18, 228 62, B23K 120, B23K 3102

Patent

active

059927291

ABSTRACT:
A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.

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"Micro-Soldering Method for Die Bumping/Die Attach", Research Disclosure, Jun. 1991, p. 386.
"Ultrasonic Reflow Soldering," Ultrasonics, vol. 9, No. 2, Apr. 1971, pp. 67-68.

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