Tab-type semiconductor process

Details Tab-type semiconductor process Tab-type semiconductor process

1987-10-26

1989-03-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29827, 29835, 29841, 26427211, 437207, 206330, 357 70, H01L 2166

Patent

active

048124214

ABSTRACT:
A TAB (Tape Automated Bonding) process uses single-layer tapes to form a semiconductor structure. Beam leads on a metal tape are "inner-lead bonded" to a chip. Each chip site on a specially-formed plastic tape has a central portion and a peripheral portion which are bonded to the chip so that the central portion forms a protective cover over the chip and the peripheral portion acts as a support for the beam leads during probe testing, excising and forming operations, etc. The bottom surface of the chip preferably remains uncovered so that it can, if appropriate, be electrically connected to ground or another potential.

REFERENCES:
patent: 4065851 (1978-01-01), Kummer et al.
patent: 4331740 (1982-05-01), Burns
Article entitled "Motorola Adopts TapePak As Next Generation Packaging Standard", appearing on p. 6 of National Anthem, Jun./Jul. 87.
Article entitled "TAB Rebounds as I/Os Increase", by Markstein, appearing on p. 42 of Electronic Packaging and Production, Aug. 1986.

Affiliated with

Also associated with

Rating

Tab-type semiconductor process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tab-type semiconductor process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tab-type semiconductor process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-893675