Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface
Reexamination Certificate
2005-06-21
2005-06-21
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
With textured surface
C257S668000, C257S669000, C257S674000, C257S692000, C257S700000
Reexamination Certificate
active
06909184
ABSTRACT:
There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.
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Baba Isao
Sumiyoshi Takamitsu
Ushijima Toshihiro
Chu Chris C.
Eckert George
Hogan & Hartson LLP
Kabushiki Kaisha Toshiba
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