Tab tape, method of bonding tab tape and tab tape package

Details Tab tape, method of bonding tab tape and tab tape package Tab tape, method of bonding tab tape and tab tape package

1993-04-02

1995-03-07

Johnson, Linda B.

Package making

Methods

Forming a cover adjunct or application of a cover adjunct to...

53397, 29827, 29840, B65B 6114

Patent

active

053946758

ABSTRACT:
A TAB (tape automated bonding) tape is disclosed which includes one or more openings, each adapted to receive a semiconductor chip, and electrical leads extending into each such opening. Significantly, this TAB tape also includes means for preventing a semiconductor chip, positioned within a tape opening, from being lifted toward a bonding tool as a result of electrical leads adhering to the bonding tool, when the bonding tool is used to bond contact pads on the semiconductor chip to the leads extending into the opening.

REFERENCES:
patent: 4330790 (1982-05-01), Burns
patent: 4466183 (1984-08-01), Burns
patent: 4758927 (1988-07-01), Berg
patent: 5048180 (1991-09-01), Tanaka

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