Tab tape, method of bonding tab tape and tab tape package

Details Tab tape, method of bonding tab tape and tab tape package Tab tape, method of bonding tab tape and tab tape package

1991-11-18

1993-09-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361807, 257668, H05K 100

Patent

active

052431410

ABSTRACT:
A TAB (tape automated bonding) tape is disclosed which includes one or more openings, each adapted to receive a semiconductor chip, and electrical leads extending into each such opening. Significantly, this TAB tape also includes a device for preventing a semiconductor chip, positioned within a tape opening, from being lifted toward a bonding tool as a result of electrical leads adhering to the bonding tool, when the bonding tool is used to bond contact pads on the semiconductor chip to the leads extending into the opening.

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