Tab tape-based bare chip test and burn-in carrier

Details Tab tape-based bare chip test and burn-in carrier Tab tape-based bare chip test and burn-in carrier

1995-02-14

1997-08-12

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 104

Patent

active

056569416

ABSTRACT:
TAB tape is used to contact integrated circuit chip electrodes (without actual metallurgical bonding) at approximately 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site can be transported, tested, and burned-in like a TAB chip on tape. A TAB tape frame is utilized with the inner lead bond fingers angled upwards so that the ends of the fingers perform a scrubbing action on the chip contacts when the IC chip is engaged with the TAB tape slide carrier socket. A silicone bead provides a spring-like action underneath the fingers.

REFERENCES:
patent: 3613001 (1971-10-01), Hostetter
patent: 5162975 (1992-11-01), Matta et al.
patent: 5262925 (1993-11-01), Matta et al.

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