Tab tape and method for producing same

Details Tab tape and method for producing same Tab tape and method for producing same

1997-11-24

1999-12-28

Jones, Deborah

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

428141, 428209, 428413, 428414, 428457, 428458, 428674, 428675, 428901, 361748, 361750, 361751, 156 60, 156 732, 156249, 156252, 1562757, 156344, B32B 3100

Patent

active

060076682

ABSTRACT:
A TAB (tape automated bonding) tape of high precision is formed without the deformations of its conductor pattern and the like and which is hermetically sealed with resin. The method for producing a TAB tape includes punching required holes, such as a device hole 14 and the like, in a metal plate 10 coated with an insulating adhesive layer 12 over the area where a conductor pattern is to be formed; and forming a required conductor pattern 24 by bonding a conductor metal foil onto the adhesive layer and by etching the conductor metal foil. Thus, the material cost of this TAB tape can be reduced and the production of this tape is facilitated.

REFERENCES:
patent: 4621278 (1986-11-01), Miura
patent: 4806409 (1989-02-01), Walter et al.
patent: 4997517 (1991-03-01), Parthasarathi
Patent Abstracts of Japan, vol. 016, No. 097 (E-1176) Mar. 10, 1992 & JP-A-32 76 739 (Hitachi Ltd.) Dec. 6, 1991 *abstract*.
Patent Abstracts of Japan, vol. 016, No. 084 (E-1172) Feb. 28, 1992 & JP-A-32 70 026 (Fujitsu Limited) Dec. 2, 1991 *abstract*.
Patent Abstracts of Japan, vol. 015, No. 514 (E-1150) Dec. 27, 1991 & JP-A-32 25 935 (Tomoegawa Paper Co. Ltd.) Oct. 4, 1991 *abstract*.

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