Tab tape and method for producing same

Details Tab tape and method for producing same Tab tape and method for producing same

1995-11-14

1998-04-14

Buffalow, E. Rollins

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

361748, 361750, 361751, 428209, 428413, 428414, 428457, 428458, 428674, 428675, 428687, B32B 2738

Patent

active

057389284

ABSTRACT:
A TAB (tape automated bonding) tape of high precision is formed without the deformations of its conductor pattern and the like and which is hermetically sealed with resin. The method for producing a TAB tape includes punching required holes, such as a device hole 14 and the like, in a metal plate 10 coated with an insulating adhesive layer 12 over the area where a conductor pattern is to be formed; and forming a required conductor pattern 24 by bonding a conductor metal foil onto the adhesive layer and by etching the conductor metal foil. Thus, the material cost of this TAB tape can be reduced and the production of this tape is facilitated.

REFERENCES:
patent: 4621278 (1986-11-01), Miura
patent: 4806409 (1989-02-01), Walter et al.
patent: 4997517 (1991-03-01), Parthasarathi
Patent Abstracts of Japan vol. 016, No. 097 (E-1176) 28 Feb. 1992 (JP-A-32 76 739).
Patent Abstracts of Japan vol. 016, No. 084 (E-1172) 28 Feb. 1992 (JP-A-32 70 026).
Patent Abstracts of Japan vol. 015, No. 514 (E-1150) 27 Dec. 1991 (JP-A-32 25 935).
Patent Abstracts of Japan, vol. 016, No. 097 (E-1176) 10 Mar. 1992 & JP-A-32 76 739 (Hitachi Ltd.) 6 Dec. 1991 *abstract*.
Patent Abstracts of Japan, vol. 016, No. 084 (E-1172) 28 Feb. 1992 & JP-A-32 70 026 (Fujitsu Limited) 2 Dec. 1991 *abstract*.
Patent Abstracts of Japan, vol. 015, No. 514 (E-1150) 27 Dec. 1991 & JP-A-32 25 935 (Tomoegawa Paper Co. Ltd.) 4 Oct. 1991 *abstract*.

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