Tab package

Details Tab package Tab package

2005-05-17

2005-05-17

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S772000, C361S813000, C257S666000

Reexamination Certificate

active

06894904

ABSTRACT:
A tape automated bonding (TAB) package and a method for fabricating the same is provided. A chip (a wire-bond chip or a flip chip) is bonded to a tape carrier through thermal compression. The chip and the tape carrier are encapsulated inside a molding compound. To enhance the TAB package thermally, a heat sink is attached to the backside of the chip.

REFERENCES:
patent: 5157478 (1992-10-01), Ueda et al.
patent: 6036173 (2000-03-01), Neu et al.
patent: 6084775 (2000-07-01), Bartley et al.
patent: 6326696 (2001-12-01), Horton et al.
patent: 6649833 (2003-11-01), Caletka et al.
patent: 20030052420 (2003-03-01), Suzuki et al.

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