Tab frame and process of testing same

Details Tab frame and process of testing same Tab frame and process of testing same

1990-07-03

1992-06-09

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

174 524, 307 70, G01R 3128, H03F 152, H01L 2350

Patent

active

051210533

ABSTRACT:
A tape automated bonding (TAB) frame and a process for testing the same. The frame is designed to receive a die, an integrated chip or other similar components having output leads. The frame generally comprises a relatively thin film of dielectric material, a pattern of substantially adjacent inner lead bonds, a pattern of substantially adjacent outer lead bonds for providing input/output ports to the die, and a pattern of substantilly adjacent probe points for providing test points to the frame and the die thereon. A generally flat and rigid plate is mounted on a prober for supporting both a cut-out portion of the frame and the die thereon. The testing process includes the steps of excising the die from the frame in the form of a coupon, such that the coupon contains the pattern of scrap probe points on the TAB frame and the die; placing the excised coupon onto the prober; aligning the coupon; and testing the coupon and the die.

REFERENCES:
patent: 4716124 (1987-12-01), Yerman et al.
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4772936 (1988-09-01), Reding et al.
patent: 4806409 (1989-02-01), Walter et al.
patent: 4855672 (1989-08-01), Shreeve
patent: 4903113 (1990-02-01), Frankeny et al.

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