TAB frame and process of testing same

Details TAB frame and process of testing same TAB frame and process of testing same

1988-10-11

1991-04-16

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

174 524, 357 70, 437 8, G01R 3128, H03F 152, H01L 2350

Patent

active

050086146

ABSTRACT:
A tape automated bonding (TAB) test coupon excised from a TAB frame and a process for testing the coupon and the die mounted thereon. The coupon includes a relatively thin film of dielectric material and a pattern of substantially adjacent inner lead pads on the dielectric film. The inner lead pads are disposed in close proximity to the die. A pattern of substantially adjacent test probe pads generally surround the pattern of inner lead pads for providing test points for the frame and the die thereon. A pattern of substantially adjacent outer lead pads generally surround the pattern of test probe pads for providing input/output ports to the die. Electrical conductors interconnect the inner lead pads, the outer lead pads and the test probe pads in a predetermined conductive pattern. The inventive test process includes the steps of excising the die from the frame in the form of a coupon. The coupon contains the die, the inner lead pads and the pattern of test probe points. The coupon is then placed onto a test prober and the die is aligned in preparation for testing.

REFERENCES:
patent: 4575747 (1986-03-01), Fritz
patent: 4772936 (1988-09-01), Reding et al.
patent: 4806409 (1989-02-01), Walter et al.

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