Tab device excise and lead form apparatus

Details Tab device excise and lead form apparatus Tab device excise and lead form apparatus

1988-12-21

1989-10-31

Seidel, Richard K.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

With means to treat workpieces

228 62, 228 13, 228 151, 228 10, 29835, H01L 2198

Patent

active

048771740

ABSTRACT:
Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.

REFERENCES:
patent: 3488672 (1970-01-01), Martyn
patent: 3887783 (1975-06-01), Comette
patent: 4071180 (1978-01-01), Dupuis
patent: 4166562 (1979-09-01), Keizer et al.
patent: 4399610 (1983-08-01), Moyer
patent: 4411149 (1983-10-01), Delorme

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