Systems, methods and computer program products for prediction of

Details Systems, methods and computer program products for prediction of Systems, methods and computer program products for prediction of

1996-08-27

1998-10-13

Voeltz, Emanuel Todd

Boots, shoes, and leggings

36446828, 364578, G06F 1750

Patent

active

058222189

ABSTRACT:
Systems, methods and computer program products for predicting defect-related failures in integrated circuits produced by an integrated circuit fabrication process identify objects in a circuit layout for the integrated circuit design, each object having a location in the circuit layout and a reliability connectivity in the integrated circuit design. Sample object defects are generated for the identified objects, each sample object defect representing a defect produced in an object by the integrated circuit fabrication process and having a defect magnitude associated therewith. An accelerated life defect influence model is identified for each sample object defect, relating the lifetime of an object to the defect magnitude of a defect in the object. Sample object lifetimes are generated from the defect magnitudes associated with the sample object defects according to the corresponding identified accelerated life defect influence models. A prediction of the reliability of integrated circuits is generated from the sample object lifetimes according to the reliability connectivity of the associated objects in the integrated circuit design. Preferably, the accelerated life defect influence models include log-linear regression models, which may include deterministic object lifetime functions, each relating the defect magnitude of the at least one sample object defect to one object lifetime value, and log-linear object lifetime distributions, each relating the defect magnitude of a sample object defect to a plurality of object lifetime values.

REFERENCES:
Meeker et al., "An Accelerated Life Test Model Based on Reliability Kinetics", Technometrics, vol. 37, No. 2, May 1995, pp. 133-146.
Smy et al., "Simulation and Analysis of Electromigration Failure Distributions", Microelecron. Reliabl., vol. 34, No. 6, 1994, pp. 1047-1056.
Hunter, "Gate Oxide Reliability: The Use of Simulation to Quantify Important Aspects of Lifetime Projection from TDDB Data", 1994 IRW Final Report, 1994, pp. 95-103.
Ishizuka et al., "Photon Emission Study of ESD Protection Devices Under Second Breakdown Conditions", IEEE/IRPS, 1994, pp. 286-291.
Papp, "Simple Mixture Model of Reliability With Manufacturing Defects", Reliability Review, vol. 14, No. 1, Mar. 1994, pp. 10-13.
Menon et al., "Subpopulation Model for Void-Related Early Failure in VLSI Interconnects", SPIE, vol. 2334, 1994, pp. 23-34.
Moosa et al., "Reliability Stimulator for Improving IC Manufacturability", SPIE, vol. 2334, 1994, pp. 287-294.
Quader et al., "Hot-Carrier Reliability Design Guidelines for CMOS Logic Circuits", IEEE 1993 Custom Integrated Circuits Conference, pp. 30.7.1-30.7.4.
Huston, "Reliability Defect Detection and Screening During Processing--Theory and Implementation", IEEE/IRPS, 1992, pp. 268-275.
Hu, "The Berkeley Reliability Simulator BERT: An IC Reliability Simulator", Microelectronics Journal, V. 233, No. 2, Apr. 1992, pp. 97-102.
Hu, "IC Reliability Simulation", IEEE Journal of Solid-State Circuits, vol. 27, No. 3, Mar. 1992, pp. 241-246.
Hu, "IC Reliability Simulation (Invited Paper)", IEEE 1991 Custom Integrated Circuits Conference, pp. 4.1.1-4.1.4.
Trindade, "Can Burn-In Screen Wearout Mechanisms?: Reliability Modeling of Defective Subpopulations--A Case Study", IEEE/IRPS, 1991, pp. 260-263.
Lloyd et al., "The Electromigration Failure Distribution: The Fine-Line Case", J. Appl. Phys., V. 69, No. 4, Feb. 15, 1991, pp. 2117-2127.
Stevenson et al., "Microelectronics Reliability Predictions Derived from Component Defect Densities", 1990 Proceedings Annual Reliability and Maintainability Symposium, pp. 366-371.
Burnett et al., "Bipolar Circuit Reliability Simulation", IEDM, 1990, pp. 181-184.
Moazzami, "Projecting Gate Oxide Reliability and Optimizing Reliability Screens", IEEE Transactions on Electron Devices, vol. 37, No. 7, Jul. 1990, pp. 1643-1650.
Kemp et al., "The Effects of Defects on the Early Failure of Metal Interconnects", IEEE Transactions on Reliability, vol. 39, No. 1, Apr. 1990, pp. 26-29.
Liew et al., "Reliability Simulator for Interconnect and Intermetallic Contact Electromigration", IEEE/IRPS, 1990, pp. 111-118.
Rosenbaum et al., "Circuit Reliability Simulator--Oxide Breakdown Module", IEDM, 1989, pp. 331-334.
Jensen, "Component Failures Based on Flaw Distribution", 1989 Proceedings Annual Reliability and Maintainability Symposium, pp. 91-95.
Frost et al., "RELIANT: A Reliability Analysis Tool for VLSI Interconnects", IEEE Journal of Solid-State Circuits, vol. 24, No. 2, Apr. 1989, pp. 458-462.
Lee et al., "Modeling and Characterization of Gate Oxide Reliability", IEEE Transactions on Electron Devices, vol. 35, No. 12, Dec. 1988, pp. 2268-2278.
Meeker, Jr., "Limited Failure Population Life Tests: Application to Integrated Circuit Reliability", Technometrics, vol. 29, No. 1, Feb. 1987, pp. 51-65.
Lawless, "Miscellanea: A Note on Lifetime Regression Models", Biometrika, vol. 73, No. 2, 1986, pp. 509-512.
Cox et al., "Dependence on Explanatory Variables: Model Formulation", Chapter 5, Analysis of Survival Data, Chapman and Hall, 1984, pp. 62-77.
Bobbio et al., "Fast Algorithm for Unavailability and Sensitivity Analysis of Series-Parallel Systems", IEEE Transactions on Reliability, vol. R-31, No. 4, Oct. 1982, pp. 359-361.
Farewell et al., "A Study of Distributional Shape in Life Testing", Technometrics, vol. 19, No. 1, Feb. 1977, pp. 69-75.

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