Systems for wafer level burn-in of electronic devices

Details Systems for wafer level burn-in of electronic devices Systems for wafer level burn-in of electronic devices

2007-03-13

2007-03-13

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

10486672

ABSTRACT:
In one example, a wafer level burn-in system includes a first electrode plate for providing electrical contact simultaneously to contacts of a group of semiconductor devices borne by a semiconductor wafer on a device surface of the semiconductor wafer. A second electrode plate is employed for providing electrical contact to a substrate surface of the semiconductor wafer. Finally, an electrical power generator is employed for providing electrical power to the group of semiconductor devices through the contacts and the substrate of the semiconductor wafer through the first and second electrode plates.

REFERENCES:
patent: 4276098 (1981-06-01), Nelson et al.
patent: 4860079 (1989-08-01), Turner
patent: 5513200 (1996-04-01), Paoli
patent: 5570032 (1996-10-01), Atkins et al.
patent: 5929651 (1999-07-01), Leas et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6204074 (2001-03-01), Fiore et al.
patent: 6222206 (2001-04-01), Chirovsky et al.
patent: 6229329 (2001-05-01), Nakata et al.
patent: 6340302 (2002-01-01), Ladd
patent: 6351134 (2002-02-01), Leas et al.
patent: 6549026 (2003-04-01), DiBattista et al.
patent: 6623997 (2003-09-01), Chang et al.
patent: 6771086 (2004-08-01), Lutz et al.
patent: 6842029 (2005-01-01), Howland
patent: 4223658 (1993-01-01), None
patent: 0841572 (1998-05-01), None
patent: 05029418 (1993-05-01), None
patent: 10178074 (1998-06-01), None
patent: 2000111576 (2000-04-01), None
patent: 2001050983 (2001-02-01), None
“Full-Wafer Burn-In of Diode Lasers”, IBM Technical Disclosure Bulletin, IBM Corp. New York, NY. vol. 35, No. 4A, Sep. 1, 1992, pp. 487-489.

Affiliated with

Also associated with

Rating

Systems for wafer level burn-in of electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems for wafer level burn-in of electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems for wafer level burn-in of electronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3795697