Systems for planarizing workpieces, e.g., microelectronic...

Details Systems for planarizing workpieces, e.g., microelectronic... Systems for planarizing workpieces, e.g., microelectronic...

2006-06-21

2008-08-26

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C438S005000, C451S006000, C451S008000, C451S010000

Reexamination Certificate

active

07416472

ABSTRACT:
This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change in thickness is determined. This thickness change is modified by a thickness offset associated with the second planarizing process and a material removal rate is calculated from this modified thickness change and the time on the first planarizer. A thickness of a second microfeature workpiece is measured and a target thickness of material to be removed is determined. A target planarizing time is then determined as a function of the target thickness reduction and the material removal rate.

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