Systems for patterning dielectrics by laser ablation

Details Systems for patterning dielectrics by laser ablation Systems for patterning dielectrics by laser ablation

1993-02-08

1994-04-12

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

156643, 156656, 21912168, 437235, H01L 21283, H01L 21306

Patent

active

053025474

ABSTRACT:
A differentiable ablation approach to patterning dielectrics which are not of the same absorbance uses an absorbant dielectric at a specified laser wavelength over a non-absorbant dielectric at that wavelength. The absorbant dielectric may be laser-patterned and become an integral mask enabling plasma etching of the underlying non-absorbant dielectric. If the patterning of the absorbant dielectric involves vias, polymer ridges formed around via surfaces during laser patterning may be removed at the same time the underlying non-absorbant dielectric is etched using a transparent, oxygen plasma resistant mask. Alternatively, an inert mask may be used instead of the absorbant dielectric to allow plasma etching of the non-absorbant dielectric.

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patent: 5130229 (1992-07-01), Chang et al.
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