Systems for electroplating metal onto a layer of low...

Details Systems for electroplating metal onto a layer of low... Systems for electroplating metal onto a layer of low...

2006-02-21

2006-02-21

King, Roy (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S230600

Reexamination Certificate

active

07001492

ABSTRACT:
A method of electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing the amplitude of both the cathodic and anodic portions of the waveform across the surface of the low conductivity layer as the deposition zone moves from the center of the surface of the low conductivity layer to the outside edge. By virtue of the ability to vary the amplitude and duration of the pulse, the method facilitates the filling of structures in the center of the low conductivity layer without overdepositing on the outside edge, thus ensuring a controlled deposition of material across the surface of the low conductivity layer.

REFERENCES:
patent: 4666567 (1987-05-01), Loch
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6071398 (2000-06-01), Martin et al.
patent: 6261433 (2001-07-01), Landau
patent: 6402924 (2002-06-01), Martin et al.
patent: 6723219 (2004-04-01), Collins
patent: 2001/0054557 (2001-12-01), Taylor et al.
“Pulsed Electrodeposition of Copper Metallization from an Alkaline Bath,” Electrochemical Society Proceedings vol. 98-6, Krishnamoorthy et al., pp. 185-194.

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