Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-12-18
2007-12-18
Bali, Vikkram (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S143000, C382S145000
Reexamination Certificate
active
11479076
ABSTRACT:
A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has been reached.
REFERENCES:
patent: 5060063 (1991-10-01), Freeman
patent: 5172420 (1992-12-01), Ray et al.
patent: RE34615 (1994-05-01), Freeman
patent: 5455870 (1995-10-01), Sepai et al.
patent: 5801965 (1998-09-01), Takagi et al.
patent: 5807606 (1998-09-01), Mould et al.
patent: 5873939 (1999-02-01), Doyle et al.
patent: 6066206 (2000-05-01), Doyle et al.
patent: 6324973 (2001-12-01), Rossmeisl et al.
patent: 6362877 (2002-03-01), Kobayashi et al.
patent: 6366690 (2002-04-01), Smilansky et al.
patent: 6549648 (2003-04-01), Rinn
patent: 6738505 (2004-05-01), Prince
patent: 6891967 (2005-05-01), Prince
patent: 2002/0019729 (2002-02-01), Chang et al.
patent: 2004/0218808 (2004-11-01), Prince
patent: 2 286 670 (1995-08-01), None
patent: WO 95/16247 (1995-06-01), None
patent: WO 98/37741 (1998-08-01), None
patent: WO 00/67005 (2000-11-01), None
Ritter et al., “Handbook of Computer Vision Algorithms in Image Algebra,” CRC Press, Inc., Boca Raton, FL (1996), Ch. 2, 3, 4 and 5 (pp. 51-172).
Russ, John C., “The Image Processing Handbook,” 2ndEdition, CRC Press, Inc., Boca Raton, FL (1995), pp. 155-160, 211-237, 259-262, 361-371, 416-431, 481-545.
International Search Report for PCT/US00/12121 mailed Sep. 1, 2000.
Brochure, DEK Printing Machines Ltd., “DEK 265GSx Engineering Specification,” Issue 01, Jan. 10, 1996, pp. 2-39.
DEK, “2D Inspection Manual,” Issue 2, Jun. 1996, pp. 3-38.
International Search Report for PCT/US2005/004823 mailed May 20, 2005.
International Search Report for PCT/US04/41462 mailed Oct. 4, 2005.
Bali Vikkram
Lowrie Lando & Anastasi, LLP
Speedline Technologies, Inc.
LandOfFree
Systems for detecting defects in printed solder paste does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems for detecting defects in printed solder paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems for detecting defects in printed solder paste will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3846813