Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-10-31
2010-02-23
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S781000, C257SE23015
Reexamination Certificate
active
07667324
ABSTRACT:
Disclosed are various embodiments of systems, devices and methods for forming an hermetic seal between a lid and a submount for an electronics module or package. At least one thieving pad is connected to a metallized ring formed about or near the circumference of an upper surface of the submount. A corresponding metallized ring is disposed about the lower perimeter of the lid. Solder paste is placed between the two metallized rings and melted, preferably under a reducing atmosphere. Excess molten solder controllably flows towards the at least one thieving pattern while the lid is being hermetically sealed and soldered, avoiding the formation of undesired wayward solder balls inside the package.
REFERENCES:
patent: 6194789 (2001-02-01), Zhou
patent: 6218730 (2001-04-01), Toy et al.
patent: 6294408 (2001-09-01), Edwards et al.
patent: 6429511 (2002-08-01), Ruby et al.
patent: 6613498 (2003-09-01), Brown et al.
patent: 6784535 (2004-08-01), Chiu
patent: 6849941 (2005-02-01), Hill et al.
patent: 6860652 (2005-03-01), Narayan et al.
patent: 6867368 (2005-03-01), Kumar et al.
patent: 6900509 (2005-05-01), Gallup et al.
patent: 6905618 (2005-06-01), Matthew et al.
patent: 6919222 (2005-07-01), Geefay
patent: 6932522 (2005-08-01), Zhou
patent: 6936919 (2005-08-01), Chuang et al.
patent: 6947224 (2005-09-01), Wang
patent: 6996304 (2006-02-01), Aronson et al.
patent: 6998691 (2006-02-01), Baugh et al.
patent: 7066660 (2006-06-01), Ellison
patent: 7091601 (2006-08-01), Philliber
patent: 7176436 (2007-02-01), Zheng et al.
patent: 2003/0116825 (2003-06-01), Geefay
patent: 2003/0197254 (2003-10-01), Huang
patent: 2003/0223709 (2003-12-01), Lake et al.
patent: 2004/0086011 (2004-05-01), Bhandarkar
ATV “Perfect Reflow Soldering” Sales Brochure (Date unkown).
Coleman Christopher L.
McColloch Laurence R.
Wang Tak K.
Avago Technologies Fiber (IP) Singapore Pte. Ltd.
Monbleau Davienne
Trinh Hao B
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