Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-08-10
2010-06-29
Stafira, Michael P (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237400
Reexamination Certificate
active
07746459
ABSTRACT:
Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
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Biellak Stephen
Kadkly Azmi
Vaez-Iravani Mehdi
KLA-Tencor Technologies Corp.
Mewherter Ann Marie
Stafira Michael P
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