Systems and slurries for chemical mechanical polishing

Details Systems and slurries for chemical mechanical polishing Systems and slurries for chemical mechanical polishing

2006-05-30

2006-05-30

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S057000, C451S065000, C451S285000, C438S690000, C051S307000

Reexamination Certificate

active

07052373

ABSTRACT:
Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.

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