Systems and methods to laminate passives onto substrate

Details Systems and methods to laminate passives onto substrate Systems and methods to laminate passives onto substrate

2011-07-19

2011-07-19

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Making passive device

C438S171000, C438S190000

Reexamination Certificate

active

07981758

ABSTRACT:
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.

REFERENCES:
patent: 4466181 (1984-08-01), Takishima
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5225023 (1993-07-01), Wojnarowski et al.
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 6838750 (2005-01-01), Nuytkens et al.
patent: 2008/0148560 (2008-06-01), Seh et al.

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